%0 Journal Article %1 journals/mr/VandeveldeVPDBA17 %A Vandevelde, Bart %A Vanhee, Filip %A Pissoort, Davy %A Degrendele, Lieven %A de Baets, Johan %A Allaert, Bart %A Lauwaert, Ralph %A Zanon, Franco %A Labie, Riet %A Willems, Geert %D 2017 %J Microelectron. Reliab. %K dblp %P 131-135 %T Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. %U http://dblp.uni-trier.de/db/journals/mr/mr74.html#VandeveldeVPDBA17 %V 74

@article{journals/mr/VandeveldeVPDBA17, added-at = {2020-02-22T00:00:00.000+0100}, author = {Vandevelde, Bart and Vanhee, Filip and Pissoort, Davy and Degrendele, Lieven and de Baets, Johan and Allaert, Bart and Lauwaert, Ralph and Zanon, Franco and Labie, Riet and Willems, Geert}, biburl = {https://www.bibsonomy.org/bibtex/2cb256b623977e2cf01dadb1516123e14/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.04.008}, interhash = {7ee3e962062faad316e831690b614c11}, intrahash = {cb256b623977e2cf01dadb1516123e14}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {131-135}, timestamp = {2020-02-25T13:27:10.000+0100}, title = {Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr74.html#VandeveldeVPDBA17}, volume = 74, year = 2017 }