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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.

, , , , , , , , , and . Microelectron. Reliab., (2017)

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Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components., , , , , , , , , and . Microelectron. Reliab., (2017)Impact of Selective Implementation on Soft Error Detection Through Low-level Re-execution., , , , and . DASC/PiCom/CBDCom/CyberSciTech, page 112-117. IEEE, (2021)EMI Risk Management: A necessity for safe and reliable electronic systems!, , and . ICCE-Berlin, page 208-210. IEEE, (2015)An Improved Data Error Detection Technique for Dependable Embedded Software., , , , and . PRDC, page 213-220. IEEE, (2018)Control Flow Errors in an Industry 4.0 Setup: a Preliminary Study., , , , and . SMC, page 2305-2310. IEEE, (2019)Case Study Analysis of STPA as Basis for Dynamic Safety Assurance of Autonomous Systems., , , , and . EDCC Workshops, volume 1656 of Communications in Computer and Information Science, page 37-45. Springer, (2022)Evaluation of the A&S and the Advanced EMI Detectors Based on Modeling Frameworks With Appropriate Condition Assessment., , , and . IEEE Access, (2023)Prediction of Capacitor's Accelerated Aging Based on Advanced Measurements and Deep Neural Network Techniques., , , and . IEEE Trans. Instrum. Meas., 69 (11): 9019-9027 (2020)Long-Term Prediction of Multistress Accelerated Aging of Capacitors by Long Short-Term Memory Network., , , and . IEEE Trans. Instrum. Meas., (2023)Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principle., , and . EMC Compo, page 50-55. IEEE, (2015)