%0 Conference Paper %1 conf/iscas/FengZCWGXW03 %A Feng, Haigang %A Zhan, Rouying %A Chen, Guang %A Wu, Qiong %A Guan, Xiaokang %A Xie, Haolu %A Wang, Albert Z. %B ISCAS (1) %D 2003 %I IEEE %K dblp %P 741-744 %T Bonding-pad-oriented on-chip ESD protection structures for ICs. %U http://dblp.uni-trier.de/db/conf/iscas/iscas2003-1.html#FengZCWGXW03 %@ 0-7803-7761-3

@inproceedings{conf/iscas/FengZCWGXW03, added-at = {2023-07-14T00:00:00.000+0200}, author = {Feng, Haigang and Zhan, Rouying and Chen, Guang and Wu, Qiong and Guan, Xiaokang and Xie, Haolu and Wang, Albert Z.}, biburl = {https://www.bibsonomy.org/bibtex/2315e71e6ee24cc9a697f83f2d06938b4/dblp}, booktitle = {ISCAS (1)}, crossref = {conf/iscas/2003}, ee = {https://doi.org/10.1109/ISCAS.2003.1205670}, interhash = {c76959aeb11ebdf23efceae30dcd1831}, intrahash = {315e71e6ee24cc9a697f83f2d06938b4}, isbn = {0-7803-7761-3}, keywords = {dblp}, pages = {741-744}, publisher = {IEEE}, timestamp = {2024-04-10T17:46:45.000+0200}, title = {Bonding-pad-oriented on-chip ESD protection structures for ICs.}, url = {http://dblp.uni-trier.de/db/conf/iscas/iscas2003-1.html#FengZCWGXW03}, year = 2003 }