%0 Journal Article %1 journals/tc/YaghiniEYBG16 %A Yaghini, Pooria M. %A Eghbal, Ashkan %A Yazdi, Siavash S. %A Bagherzadeh, Nader %A Green, Michael M. %D 2016 %J IEEE Trans. Computers %K dblp %N 3 %P 693-705 %T Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs. %U http://dblp.uni-trier.de/db/journals/tc/tc65.html#YaghiniEYBG16 %V 65

@article{journals/tc/YaghiniEYBG16, added-at = {2020-06-15T00:00:00.000+0200}, author = {Yaghini, Pooria M. and Eghbal, Ashkan and Yazdi, Siavash S. and Bagherzadeh, Nader and Green, Michael M.}, biburl = {https://www.bibsonomy.org/bibtex/2343dfabfa50738c09c673fc361a4236b/dblp}, ee = {http://doi.ieeecomputersociety.org/10.1109/TC.2015.2498550}, interhash = {c8b3d4faa7ee75cde598d831ef44aa4d}, intrahash = {343dfabfa50738c09c673fc361a4236b}, journal = {IEEE Trans. Computers}, keywords = {dblp}, number = 3, pages = {693-705}, timestamp = {2020-06-16T11:51:57.000+0200}, title = {Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs.}, url = {http://dblp.uni-trier.de/db/journals/tc/tc65.html#YaghiniEYBG16}, volume = 65, year = 2016 }