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A Cycle-Accurate ISS for a Dynamically Reconfigurable Processor Architecture.

, , , , , and . IPDPS, IEEE Computer Society, (2005)

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3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly., , , , , , , and . IEEE J. Solid State Circuits, 42 (10): 2270-2282 (2007)SiCILIA - Silicon Carbide Detectors for Intense Luminosity Investigations and Applications., , , , , , , , , and 33 other author(s). Sensors, 18 (7): 2289 (2018)Human-centric connectivity enabled by body-coupled communications., , , , and . IEEE Communications Magazine, 47 (6): 172-178 (2009)Design and analysis of 3D interconnection systems.. University of Bologna, Italy, (2006)3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities., , , , , , , and . IEEE J. Solid State Circuits, 43 (1): 275-284 (2008)A Cycle-Accurate ISS for a Dynamically Reconfigurable Processor Architecture., , , , , and . IPDPS, IEEE Computer Society, (2005)Yield prediction for 3D capacitive interconnections., , , , , , , and . ICCAD, page 809-814. ACM, (2006)3D Capacitive Interconnections for High Speed Interchip Communication., , , , , , , , and . CICC, page 1-8. IEEE, (2007)A 2.75mW wideband correlation-based transceiver for body-coupled communication., , and . ISSCC, page 204-205. IEEE, (2009)Electrical measurement of alignment for 3D stacked chips., , , , , and . ESSCIRC, page 347-350. IEEE, (2005)