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Disambiguation of "Kim, Young-Suk"

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Influence of wafer thinning process on backside damage in 3D integration.

, , , , , , , , , , , and . 3DIC, page 1-6. IEEE, (2013)

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Young-Suk Kim

Young-Suk Kim

Young Kim

Young Kim

Young Kim

 

Other publications of authors with the same name

Preparation of a PLGA/Calcium Silicate Composite with Gradient Pore Structure., , and . BIODEVICES, page 239-242. SciTePress, (2013)Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network., , , , , , , , , and 1 other author(s). VLSI Technology and Circuits, page 385-386. IEEE, (2022)Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs., , , , , , and . IRPS, page 1-6. IEEE, (2021)Influence of wafer thinning process on backside damage in 3D integration., , , , , , , , , and 2 other author(s). 3DIC, page 1-6. IEEE, (2013)Determination of Odor Release in Hydrocolloid Model Systems Containing Original or Carboxylated Cellulose at Different pH Values Using Static Headspace Gas Chromatographic (SHS-GC) Analysis., , , , and . Sensors, 13 (3): 2818-2829 (2013)Mobile advertisement system using data push scheduling based on user preference., , , and . WTS, page 1-5. IEEE, (2009)Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures., , , , , , and . 3DIC, page 1-4. IEEE, (2011)Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation., , , , , and . IEICE Electron. Express, 12 (7): 20152002 (2015)Synthesis of a bioactive and degradable 70Poly(50Lactic-co-50Glycoric acid)/30(60SiO2-40CaQ) composite with dual pore structure., , , and . BIBE, page 1-5. IEEE Computer Society, (2015)Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias., , , , , , and . 3DIC, page 1-4. IEEE, (2019)