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Failure analysis and detection methodology for capacitive RF-MEMS switches based on BEOL BiCMOS process.

, , , , , and . Microelectron. Reliab., 53 (9-11): 1659-1662 (2013)

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Failure analysis and detection methodology for capacitive RF-MEMS switches based on BEOL BiCMOS process., , , , , and . Microelectron. Reliab., 53 (9-11): 1659-1662 (2013)Building blocks for an X-Band SiGe BiCMOS T/R module., , , and . RWS, page 301-303. IEEE, (2013)A Co-Integrated Silicon-Based Electronic-Photonic Wideband, High-Power Signal Source., , , , , , , , , and 3 other author(s). OFC, page 1-3. IEEE, (2020)A 6-mW W-Band LNA in 0.13µm SiGe BiCMOS for Passive Imaging Systems., , , , and . MWSCAS, page 436-439. IEEE, (2020)Ultra-Low Noise Amplifier for X-Band SiGe BiCMOS Phased Array Applications., , , , and . IEEE Trans. Circuits Syst. II Express Briefs, 66-II (9): 1507-1511 (2019)Estimation of RF performance from LF measurements: Towards the design for reliability in RF-MEMS., , , , , and . Microelectron. Reliab., 52 (9-10): 2310-2313 (2012)A 4-bit SiGe passive phase shifter for X-band phased arrays., , , and . RWS, page 310-312. IEEE, (2013)A 0.9 mW Compact Power Detector with 30 dB Dynamic Range for Automotive Radar Applications., , , , and . MWSCAS, page 541-544. IEEE, (2020)200 mm Wafer level graphene transfer by wafer bonding technique., , , , , , , and . ESSDERC, page 216-219. IEEE, (2017)Advanced Thermal Modeling of IC - Package Interaction., , , , , and . RWS, page 326-329. IEEE, (2020)