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Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.

W. Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, and A. Buxbaum. 3DIC, page 1-6. IEEE, (2010)

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D Zeppenfeld

D Zumkeller

D Carl

D Bruß

D Breunig

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Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.W. Teh, C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz, and A. Buxbaum. 3DIC, page 1-6. IEEE, (2010)

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Disambiguation of "Arazi, D."

Please choose a person to relate this publication to

D Zeppenfeld

D Zumkeller

D Carl

D Bruß

D Breunig

Other publications of authors with the same name

Disambiguation

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Disambiguation of "Arazi, D."

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding.

Please choose a person to relate this publication to

D Zeppenfeld

D Zumkeller

D Carl

D Bruß

D Breunig

Other publications of authors with the same name

Disambiguation