( en | de | ru )

 

Disambiguation of "Ji, Yongsung"

Author of the publication

copydeleteadd this publication to your clipboard
Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET.

, , , , , , , , , , , , , , , and . IRPS, page 1-5. IEEE, (2020)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Hui Ji

Ji Haas

Ji Vymer

Yanbin Ji

Ji Prokop

 

Other publications of authors with the same name

Reliability of Industrial grade Embedded-STT-MRAM., , , , , , , , , and 21 other author(s). IRPS, page 1-3. IEEE, (2020)Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology., , , , , , , , , and 3 other author(s). IRPS, page 1-5. IEEE, (2020)Reliability on EUV Interconnect Technology for 7nm and beyond., , , , , , , , , and 7 other author(s). IRPS, page 1-4. IEEE, (2020)Reliability of STT-MRAM for various embedded applications., , , , , , , , , and 3 other author(s). IRPS, page 1-5. IEEE, (2021)A 14nm 128Mb Embedded MRAM Macro achieved the Best Figure-Of-Merit with 80MHz Read operation and 18.1Mb/mm² implementation at 0.64V., , , , , , , , , and 2 other author(s). VLSI Technology and Circuits, page 1-2. IEEE, (2023)Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET., , , , , , , , , and 6 other author(s). IRPS, page 1-5. IEEE, (2020)Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM., , , , , , , , , and 4 other author(s). IRPS, page 1-4. IEEE, (2020)