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Disambiguation of "Fan, Xuejun"

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Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component.

, , , , , , , and . Microelectron. Reliab., (2017)

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Xuejun Wu

Xuejun Chai

Xuejun Liu

Xuejun Yuan

Xuejun Sheng

 

Other publications of authors with the same name

A new hermetic sealing method for ceramic package using nanosilver sintering technology., , , , , , and . Microelectron. Reliab., (2018)A Reliability Prediction Methodology for LED Arrays., , , , and . IEEE Access, (2019)Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling., , and . Microelectron. Reliab., 44 (12): 1967-1976 (2004)Speeding up Scalar Multiplication on Koblitz Curves Using _4 Coordinates., , , and . ACISP, volume 11547 of Lecture Notes in Computer Science, page 620-629. Springer, (2019)A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation., , , , , , and . Reliab. Eng. Syst. Saf., (2017)A design and qualification of LED flip Chip-on-Board module with tunable color temperatures., , , , , and . Microelectron. Reliab., (2018)PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers., , , and . IEEE Trans. Ind. Electron., 63 (11): 6726-6735 (2016)CSURF-TWO: CSIDH for the Ratio (2 : 1)., , , and . Inscrypt, volume 12612 of Lecture Notes in Computer Science, page 148-156. Springer, (2020)Group Key Exchange Protocols from Supersingular Isogenies., , and . Inscrypt, volume 12612 of Lecture Notes in Computer Science, page 157-173. Springer, (2020)Numerical Thermal Analysis and Optimization of Multi-Chip LED Module Using Response Surface Methodology and Genetic Algorithm., , , , , and . IEEE Access, (2017)