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Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging., и . Microelectron. Reliab., 53 (2): 334-347 (2013)Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance., , и . Microelectron. Reliab., 52 (4): 744-756 (2012)Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process., , и . Microelectron. Reliab., (2016)Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process., , , и . Microelectron. Reliab., 50 (1): 98-105 (2010)Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology., , , и . Simul. Model. Pract. Theory, (2015)Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology., и . Simul. Model. Pract. Theory, (2012)Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink., и . Microelectron. Reliab., (2017)Lattice Boltzmann method study of bga bump arrangements on void formation., , , , и . Microelectron. Reliab., (2016)Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches., , и . Microelectron. Reliab., (2018)Investigation of the fluid/structure interaction phenomenon in IC packaging., , , , и . Microelectron. Reliab., 52 (1): 241-252 (2012)