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3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation., , , , , , , and . CICC, page 663-670. IEEE, (2008)Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems., , and . CICC, page 421-428. IEEE, (2007)Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection., , , , , , , , , and 10 other author(s). IBM J. Res. Dev., 49 (4-5): 725-754 (2005)An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects., , , , , , , , , and 4 other author(s). IEEE J. Solid State Circuits, 47 (4): 884-896 (2012)A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring., , , , , , , , , and . ICDH, page 88-90. IEEE, (2023)Health Guardian: Using Multi-modal Data to Understand Individual Health., , , , , , , , , and . ICDH, page 65-74. IEEE, (2023)Development of a Smart Sleep Mask with Multiple Sensors., , , , , , , , and . EMBC, page 7058-7062. IEEE, (2021)NOx Emission Flux Measurements with Multiple Mobile-DOAS Instruments in Beijing., , , , , , , , and . Remote. Sens., 12 (16): 2527 (2020)Fabrication and characterization of robust through-silicon vias for silicon-carrier applications., , , , , , and . IBM J. Res. Dev., 52 (6): 571-581 (2008)3D chip stacking with C4 technology., , , , , , , , , and 4 other author(s). IBM J. Res. Dev., 52 (6): 599-609 (2008)