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TSocket: Thermal Sustainable Power Budgeting.

, , , , , , and . ACM Trans. Design Autom. Electr. Syst., 21 (2): 29:1-29:22 (2016)

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Enabling architectural innovations using non-volatile memory., , , , , , and . ACM Great Lakes Symposium on VLSI, page 439-444. ACM, (2011)RADAR: a 3D-reRAM based DNA alignment accelerator architecture., , , and . DAC, page 59:1-59:6. ACM, (2018)CORN: In-Buffer Computing for Binary Neural Network., , , , , and . DATE, page 384-389. IEEE, (2019)Investigation and comparison of thermal distribution in synchronous and asynchronous 3D ICs., , , , , and . 3DIC, page 1-5. IEEE, (2009)Arithmetic unit design using 180nm TSV-based 3D stacking technology., , , , , , and . 3DIC, page 1-4. IEEE, (2009)Compact models and model standard for 2.5D and 3D integration., and . SLIP, page 7:1-7:7. IEEE Computer Society, (2014)Tackling the Qubit Mapping Problem for NISQ-Era Quantum Devices., , and . ASPLOS, page 1001-1014. ACM, (2019)FPSA: A Full System Stack Solution for Reconfigurable ReRAM-based NN Accelerator Architecture., , , , , , , and . ASPLOS, page 733-747. ACM, (2019)Acoustic anomaly detection via latent regularized gaussian mixture generative adversarial networks., , , , , , and . CoRR, (2020)An Optimized Face Recognition for Edge Computing., , , and . ASICON, page 1-4. IEEE, (2019)