Author of the publication

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Bidirectional electromigration failure.

M. Lim, V. Chouliaras, C. Gan, and V. Dwyer. Microelectron. Reliab., 53 (9-11): 1261-1265 (2013)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters.A. Lim, A. Chang, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., 54 (11): 2555-2563 (2014)Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.A. Lim, C. Boothroyd, O. Yauw, B. Chylak, C. Gan, and Z. Chen. Microelectron. Reliab., (2016)Effects of voltage stress on the single event upset (SEU) response of 65 nm flip flop.C. Chua, H. Ong, K. Sanchez, P. Perdu, and C. Gan. Microelectron. Reliab., (2016)Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations.S. Alam, C. Gan, C. Thompson, and D. Troxel. Microelectron. J., 38 (4-5): 463-473 (2007)Unsupervised learning for signal mapping in dynamic photon emission.S. Chef, S. Jacquir, K. Sanchez, P. Perdu, S. Binczak, and C. Gan. Microelectron. Reliab., 55 (9-10): 1564-1568 (2015)Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors.W. Sasangka, Y. Gao, C. Gan, and C. Thompson. Microelectron. Reliab., (2018)Embedded-EEPROM descrambling via laser-based techniques - A case study on AVR MCU.S. Chef, C. Chua, J. Tay, J. Cheah, and C. Gan. FDTC, page 1-8. IEEE, (2022)Copper micro and nano particles mixture for 3D interconnections application.Y. Dai, M. Ng, P. Anantha, C. Gan, and C. Tan. 3DIC, page TS8.9.1-TS8.9.5. IEEE, (2015)Atmospheric corrosion resistance of electroplated Ni/Ni-P/Au electronic contacts.V. Murugan, Z. Jia, G. Syaranamual, C. Gan, Y. Huang, and Z. Chen. Microelectron. Reliab., (2016)Characterisation of defects generated during constant current InGaN-on-silicon LED operation.R. Made, Y. Gao, G. Syaranamual, W. Sasangka, L. Zhang, X. Nguyen, Y. Tay, J. Herrin, C. Thompson, and C. Gan. Microelectron. Reliab., (2017)

BibSonomy

Disambiguation of "Gan, Chee Lip"

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Bidirectional electromigration failure.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Gan, Chee Lip"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Bidirectional electromigration failure.

Please choose a person to relate this publication to

Bevan Cheeseman

Tian Gan

Chee Yap

Lishan Gan

Gan Lu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Bidirectional electromigration failure.