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The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications.

, , , , , , , and . ICST, page 1-6. IEEE, (2017)

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The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications., , , , , , , and . ICST, page 1-6. IEEE, (2017)Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics., , , , and . Microelectron. Reliab., (2018)Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method., , , , , , , and . DeSE, page 939-942. IEEE, (2019)The influence of liners with Ti, Ta or Ru finish on thin Cu films., , , and . Microelectron. Reliab., 54 (9-10): 1877-1882 (2014)Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor., , , , , , and . IEEE SENSORS, page 1-4. IEEE, (2021)Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C., , and . Microelectron. Reliab., 51 (1): 107-112 (2011)The European Union's Energy Label for Smartphones: Does it Guide Consumers to Make Environmentally Sustainable Choices?, , , , , and . ICCE-Berlin, page 1-6. IEEE, (2023)