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DSP-free 52km-long dispersion uncompensated optical link employing a 40 Gb/s O-band silicon microring modulator assembled with a 1V-CMOS driver., , , , , , , , , and . OECC/PSC, page 1-3. IEEE, (2019)Photonic subsystems for optical packet/burst switches based on heterogeneous SOI and III-V integration., , , , , , and . OFC, page 1-3. IEEE, (2015)Highly uniform and low-loss passive silicon photonics devices using a 300mm CMOS platform., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2014)4-Channel C-Band WDM Transmitter Based on 10 GHz Graphene-Silicon Electro-Absorption Modulators., , , , , , , and . OFC, page 1-3. IEEE, (2019)100 Gb/s DAC-less and DSP-free Transmitters using GeSi EAMs for Short-Reach Optical Interconnects., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2018)Automated Thermal Drift Compensation in WDM-Based Silicon Photonic Multi-Socket Interconnect Systems., , , , , , , , , and 5 other author(s). OFC, page 1-3. IEEE, (2020)A 400 Gb/s O-Band WDM (8×50 Gb/s) Silicon Photonic Ring Modulator-Based Transceiver., , , , , , , and . OFC, page 1-3. IEEE, (2020)Highly Optimized O-band Si Ring Modulators for Low-Power Hybrid CMOS-SiPho Transceivers., , , , , , , , , and 7 other author(s). OFC, page 1-3. IEEE, (2023)112 Gb/s PAM4 Transmission over 2 km SMF Using a C-band GeSi Electro-Absorption Modulator., , , , , , , , and . OFC, page 1-3. IEEE, (2018)Packaging and Assembly Challenges for 50G Silicon Photonics Interposers., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2018)