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A blister-test apparatus for studies on the adhesion of materials used for neural electrodes., , , and . EMBC, page 2953-2956. IEEE, (2011)Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication., , , and . EMBC, page 3886-3889. IEEE, (2012)Ensuring minimal humidity levels in hermetic implant housings., , , and . EMBC, page 2296-2299. IEEE, (2011)Improved polyimide thin-film electrodes for neural implants., , , and . EMBC, page 5134-5137. IEEE, (2012)Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In Vivo., , , , and . Sensors, 17 (1): 59 (2017)Mechanical deformation of thin film platinum under electrical stimulation., , , , and . EMBC, page 1045-1048. IEEE, (2015)Improved long-term stability of thin-film glassy carbon electrodes through the use of silicon carbide and amorphous carbon., , , , , , , , , and 2 other author(s). NER, page 288-291. IEEE, (2017)Let There Be Light - Optoprobes for Neural Implants., , , , , and . Proc. IEEE, 105 (1): 101-138 (2017)Non-hermetic encapsulation for implantable electronic devices based on epoxy., , , , and . EMBC, page 809-812. IEEE, (2015)A polymer-metal two step sealing concept for hermetic neural implant packages., , , , and . EMBC, page 3981-3984. IEEE, (2014)