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Die to wafer 3D stacking for below 10um pitch microbumps.

J. Derakhshandeh, L. Hou, I. Preter, C. Gerets, S. Suhard, V. Dubey, G. Jamieson, F. Inoue, T. Webers, P. Bex, G. Capuz, E. Beyne, J. Slabbekoorn, T. Wang, A. Jourdain, G. Beyer, K. Rebibis, and A. Miller. 3DIC, page 1-4. IEEE, (2016)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Beina Teng

Lichao Teng

Teng Fu

Kang Teng

Teng Wu

Other publications of authors with the same name

Impact of Process Variation in Fault-Resilient Streaming Nanoprocessors.M. Leuchtenburg, P. Narayanan, T. Wang, and C. Moritz. NanoNet, volume 3 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 26-27. Springer, (2008)Assessing the Performance Impact of High-Speed Interconnects on MapReduce.Y. Wang, Y. Jiao, C. Xu, X. Li, T. Wang, X. Que, C. Cira, B. Wang, Z. Liu, B. Bailey and 1 other author(s). WBDB, volume 8163 of Lecture Notes in Computer Science, page 148-163. Springer, (2012)Spatial distribution pattern of the customer count and satisfaction of commercial facilities based on social network review data in Beijing, China.T. Wang, Y. Wang, X. Zhao, and X. kang Fu. Comput. Environ. Urban Syst., (2018)DSMT-Net: Dual Self-Supervised Multi-Operator Transformation for Multi-Source Endoscopic Ultrasound Diagnosis.J. Li, P. Zhang, T. Wang, L. Zhu, R. Liu, X. Yang, K. Wang, D. Shen, and B. Sheng. IEEE Trans. Medical Imaging, 43 (1): 64-75 (January 2024)Vivid: Augmenting Vision-Based Indoor Navigation System With Edge Computing.W. Zhao, L. Xu, B. Qi, J. Hu, T. Wang, and T. Runge. IEEE Access, (2020)Image Caption with Endogenous-Exogenous Attention.T. Wang, H. Hu, and C. He. Neural Process. Lett., 50 (1): 431-443 (2019)Multiple-Order Graphical Deep Extreme Learning Machine for Unsupervised Fault Diagnosis of Rolling Bearing.X. Zhao, M. Jia, J. Bin, T. Wang, and Z. Liu. IEEE Trans. Instrum. Meas., (2021)A Graph Convolutional Network for Session Recommendation Model Based on Improved Transformer.X. Zhang, and T. Wang. IEEE Access, (2023)Event-Centric Hierarchical Representation for Dense Video Captioning.T. Wang, H. Zheng, M. Yu, Q. Tian, and H. Hu. IEEE Trans. Circuits Syst. Video Technol., 31 (5): 1890-1900 (2021)Exploiting Context Information for Generic Event Boundary Captioning.J. Zhang, T. Wang, F. Zheng, R. Cheng, and P. Luo. CoRR, (2022)

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Disambiguation of "Wang, Teng"

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Die to wafer 3D stacking for below 10um pitch microbumps.

Please choose a person to relate this publication to

Beina Teng

Lichao Teng

Teng Fu

Kang Teng

Teng Wu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Wang, Teng"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Die to wafer 3D stacking for below 10um pitch microbumps.

Please choose a person to relate this publication to

Beina Teng

Lichao Teng

Teng Fu

Kang Teng

Teng Wu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Die to wafer 3D stacking for below 10um pitch microbumps.