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3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

, , , , , , , , , , , , , , , , , , и . ICICDT, стр. 1-4. IEEE, (2012)

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Antonio la Flor Santalla

Carlo Manna

Enzo Manna

Stefano Manna

Leopold Mannaberg

 

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