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Disambiguation of "Li, Baozhen"

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Electromigration challenges for advanced on-chip Cu interconnects.

, , , and . Microelectron. Reliab., 54 (4): 712-724 (2014)

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Li Li

Li Li

Li Li

Li Li

Li Li

 

Other publications of authors with the same name

A Flexible and Inherently Self-Consistent Methodology for MOL/BEOL/MIMCAP TDDB Applications with Excessive Variability-Induced Degradation., , , , , , , and . IRPS, page 2. IEEE, (2022)Transient self-heating modeling and simulations of back-end-of-line interconnects., , and . IRPS, page 2-1. IEEE, (2018)Elapsed-time statistics of successive breakdown in the presence of variability for dielectric breakdown in BEOL/MOL/FEOL applications., , , and . IRPS, page 3. IEEE, (2018)A critical analysis of sampling-based reconstruction methodology for dielectric breakdown systems (BEOL/MOL/FEOL)., , , , , and . IRPS, page 2. IEEE, (2015)Reliability challenges for copper interconnects., , , and . Microelectron. Reliab., 44 (3): 365-380 (2004)Electromigration challenges for advanced on-chip Cu interconnects., , , and . Microelectron. Reliab., 54 (4): 712-724 (2014)Application of three-parameter lognormal distribution in EM data analysis., , , , , and . Microelectron. Reliab., 46 (12): 2049-2055 (2006)Quantum Mechanical Connection of Schottky Emission Process and Its implications on Breakdown Methodology and Conduction Modeling for BEOL Low-k Dielectrics., and . IRPS, page 10. IEEE, (2022)Comprehensive Methodology for Multiple Spots Competing Progressive Breakdown for BEOL/FEOL Applications., , , and . IRPS, page 1-8. IEEE, (2019)Transformation of Ramped Current Stress VBDto Constant Voltage Stress TDDB TBD., , , and . IRPS, page 1-5. IEEE, (2019)