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Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism.

, , , , , , , and . IRPS, page 4. IEEE, (2022)

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Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM., , , , , , , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 41 (12): 5327-5332 (2022)A tool flow for predicting system level timing failures due to interconnect reliability degradation., , , , , and . ACM Great Lakes Symposium on VLSI, page 291-296. ACM, (2008)A pragmatic network-aware paradigm for system-level electromigration predictions at scale., , , and . IRPS, page 1-6. IEEE, (2023)A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network., , , , and . SLIP, page 1-7. IEEE, (2021)Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects., , , , , , , and . IRPS, page 1-5. IEEE, (2020)Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle., , , and . Microelectron. Reliab., 48 (8-9): 1384-1387 (2008)Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation., , , , , and . Microelectron. Reliab., (2016)Towards accurate temperature prediction in BEOL for reliability assessment (Invited)., , , , , , , , , and 1 other author(s). IRPS, page 1-7. IEEE, (2023)System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents., , , , and . IRPS, page 1-7. IEEE, (2022)Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism., , , , , , , and . IRPS, page 4. IEEE, (2022)