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Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement., , , , , , , , , and 3 other author(s). 3DIC, page TS1.4.1-TS1.4.8. IEEE, (2015)Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration., , , , , , , , , and 2 other author(s). 3DIC, page 1-7. IEEE, (2013)Material improvement for ultrathin-wafer handling in TSV creation and PECVD process., , , , , , , and . 3DIC, page 1-5. IEEE, (2009)Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields., , , , , , and . 3DIC, page 1-7. IEEE, (2019)Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development., , , , , , , , , and 7 other author(s). 3DIC, page 1-5. IEEE, (2019)Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability., , , , , , , , , and 7 other author(s). IRPS, page 4. IEEE, (2018)