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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

S. Joblot, A. Farcy, N. Hotellier, A. Jouve, F. de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J. Colonna, R. Franiatte, C. Laviron, and S. Cheramy. 3DIC, page 1-7. IEEE, (2013)

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Christine Jouve

Other publications of authors with the same name

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.A. Jouve, Y. Sinquin, A. Garnier, M. Daval, P. Chausse, M. Argoud, N. Allouti, L. Baud, J. Dechamp, R. Franiatte and 3 other author(s). 3DIC, page TS1.4.1-TS1.4.8. IEEE, (2015)Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.S. Joblot, A. Farcy, N. Hotellier, A. Jouve, F. de Crecy, A. Garnier, M. Argoud, C. Ferrandon, J. Colonna, R. Franiatte and 2 other author(s). 3DIC, page 1-7. IEEE, (2013)Material improvement for ultrathin-wafer handling in TSV creation and PECVD process.A. Jouve, W. Hong, D. Blumenshine, J. Dachsteiner, R. Puligadda, D. Bai, J. Diaz, and D. Henry. 3DIC, page 1-5. IEEE, (2009)Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.A. Jouve, L. Sanchez, C. Castan, N. Bresson, F. Fournel, N. Raynaud, and P. Metzger. 3DIC, page 1-7. IEEE, (2019)Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp and 7 other author(s). 3DIC, page 1-5. IEEE, (2019)Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.L. Arnaud, S. Moreau, A. Jouve, I. Jani, D. Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, N. Bresson and 7 other author(s). IRPS, page 4. IEEE, (2018)

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Disambiguation of "Jouve, Amadine"

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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Please choose a person to relate this publication to

Christine Jouve

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Disambiguation of "Jouve, Amadine"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Please choose a person to relate this publication to

Christine Jouve

Other publications of authors with the same name

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Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.