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Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression.

, , , , , and . ASP-DAC, page 81-82. IEEE, (2013)

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Precise Deformation of Rheologic Object under MSD Models with many Voxels and Calibrating Parameters., , , and . ICRA, page 1919-1926. IEEE, (2004)A Closed Queueing Network Model for SSD Write Performance Analysis Utilizing the Batch Processing Method., , , and . GCCE, page 855-858. IEEE, (2021)x11 performance increase, x6.9 endurance enhancement, 93% energy reduction of 3D TSV-integrated hybrid ReRAM/MLC NAND SSDs by data fragmentation suppression., , , , , and . VLSIC, page 134-135. IEEE, (2012)Reinforcement learning for manipulation using constraint between object and robot., , and . SMC, page 871-876. IEEE, (2005)An evaluation of the relationship between impression and the physical properties of human skin., , , , and . SIGGRAPH Posters, page 89:1-89:2. ACM, (2016)Over 10-times high-speed, energy efficient 3D TSV-integrated hybrid ReRAM/MLC NAND SSD by intelligent data fragmentation suppression., , , , , and . ASP-DAC, page 81-82. IEEE, (2013)Revocable Group Signature Schemes with Constant Costs for Signing and Verifying., , , and . IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 93-A (1): 50-62 (2010)Analysis and Optimization of an Analog MOSFET with a Slit Well at Channel Center Towards Higher Output Resistance., , , , , , and . ESSDERC, page 328-331. IEEE, (2022)Some Properties of Well-Balanced Sequences Obtained from Two Logistic Maps over Integers., , , , and . ICCE-Taiwan, page 525-526. IEEE, (2023)Revocable Group Signature Schemes with Constant Costs for Signing and Verifying., , , and . Public Key Cryptography, volume 5443 of Lecture Notes in Computer Science, page 463-480. Springer, (2009)