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High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices., , , , , , , , , and . IEICE Trans. Electron., 102-C (4): 340-346 (2019)Monolithically integrated directly modulated DFB laser array with MMI coupler for 100GBASE-LR4 application., , , , , , , , , and . OFC, page 1-3. IEEE, (2015)Ultra-High Bandwidth InP IQ Modulator for Beyond 100-GBd Transmission., , , , , , , , , and 6 other author(s). OFC, page 1-3. IEEE, (2019)LiVRation: Remote VR live platform with interactive 3D audio-visual service., , , , , , , and . GEM, page 1-7. IEEE, (2019)Body cyberization by spatial augmented reality for reaching unreachable world., , , , , and . AH, page 19. ACM, (2017)Nanosecond-scale Hitless λ-switching of SOA-integrated Electro-optically Tunable RTF Laser with +/-2.5-GHz Dynamic Frequency Accuracy., , , , , , and . OFC, page 1-3. IEEE, (2022)Ultra-broadband EA-DFB laser module for 200-Gbit/s PAM4 transmitter., , , , , , , and . OFC, page 1-3. IEEE, (2017)ExtendedHand on Wheelchair., , , , and . UIST (Adjunct Volume), page 147-148. ACM, (2016)Vertical-Coupling Mirror Array for InP-PIC Wafer-Level Optical I/O with > 100-nm Wavelength Bandwidth., , , , , , and . OECC/PSC, page 1-4. IEEE, (2022)Ultra-Low Power Dissipation (<2.4 W) Coherent InP Modulator Module with CMOS Driver IC., , , , , , , , , and 1 other author(s). ECOC, page 1-3. IEEE, (2018)