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Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks.

, , , , and . IEEE Des. Test, 33 (2): 40-48 (2016)

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Feature Augmentation Learning for Few-Shot Palmprint Image Recognition With Unconstrained Acquisition., , , and . ICASSP, page 3323-3327. IEEE, (2022)Evaluation of Smart Response Systems for City Emergencies and Novel UV-Oriented Solution for Integration, Resilience, Inclusiveness and Sustainability., , , , , , , and . UV, page 1-51. IEEE, (2020)Evolutionary Pareto Set Learning with Structure Constraints., , , and . CoRR, (2023)Towards Modeling 3D Dense Shape Correspondence from Category-Specific Multi-View Images., and . ICIP, page 445-449. IEEE, (2023)EigenGRF: Layer-Wise Eigen-Learning for Controllable Generative Radiance Fields., and . ICONIP (1), volume 13623 of Lecture Notes in Computer Science, page 189-199. Springer, (2022)Physical Design of 3D FPGAs Embedded with Micro-channel-based Fluidic Cooling., and . FPGA, page 54-63. ACM, (2016)Assessment of hypothesized substation cyberattack using linearized power flow approach., and . ISGT, page 1-5. IEEE, (2017)Optimizing high-speed railway express system under uncertainty., , , , and . Comput. Oper. Res., (2024)Exploring the Adversarial Frontier: Quantifying Robustness via Adversarial Hypervolume., , , , and . CoRR, (2024)A Co-creation Interaction Framework and Its Application for Intelligent Design System., , , and . HCI (1), volume 13302 of Lecture Notes in Computer Science, page 343-355. Springer, (2022)