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Disambiguation of "Nguyen, Bich"

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Semi-supervised ViT knowledge distillation network with style transfer normalization for colorectal liver metastases survival prediction.

, , , , , , , , , and . CoRR, (2023)

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Nguyen Bich Dat

Bich Doan Nguyen

Bich Ha Nguyen Thi

Nguyen thi Bich Hang

Nguyen Thi Bich Van

 

Other publications of authors with the same name

Predicting the Response to FOLFOX-Based Chemotherapy Regimen from Untreated Liver Metastases on Baseline CT: a Deep Neural Network Approach., , , , , , , , , and . J. Digit. Imaging, 33 (4): 937-945 (2020)Semi-Supervised Tumor Response Grade Classification from Histology Images of Colorectal Liver Metastases., , , , , , , and . ISBI, page 1-5. IEEE, (2022)Semi-supervised ViT knowledge distillation network with style transfer normalization for colorectal liver metastases survival prediction., , , , , , , , , and . CoRR, (2023)A Generic Predictive Model for On-Street Parking Availability., , , , and . INTSYS, volume 310 of Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, page 47-60. Springer, (2019)Effect of measurement speed (μs-800 ps) on the characterization of reliability behaviors for FDSOI nMOSFETs., , , , , , , , and . IRPS, page 6. IEEE, (2018)FDSOI: From substrate to devices and circuit applications., , , , and . ESSCIRC, page 45-51. IEEE, (2010)22FD-SOI Variability Improvement Thanks to SmartCut Thickness Control at Atomic Scale., , , , , , and . ESSDERC, page 64-65. IEEE, (2019)Framework of Using Machine Leaning Techniques in Human Resource Management in Vietnamese Companies., , and . ICRMAT, volume 28 of Annals of Computer Science and Information Systems, page 295-300. (2021)Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections., , , , , , , , , and 15 other author(s). VLSI Technology and Circuits, page 330-331. IEEE, (2022)Smart Cut™ technology: from Substrate Enginnering to Advanced 3D Integration., , and . ICICDT, page 81-83. IEEE, (2022)