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Optimization and Performance Limits of a 64-QAM Wireless Communication Link at 220-260 GHz in a SiGe HBT Technology., , , и . RWS, стр. 1-3. IEEE, (2019)A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications., , , , , , , и . IEEE J. Solid State Circuits, 41 (12): 2820-2831 (2006)A 128-pixel 0.56THz sensing array for real-time near-field imaging in 0.13μm SiGe BiCMOS., , , , , , , , и . ISSCC, стр. 418-420. IEEE, (2018)RF Front-End Impairments for Ultra-Broadband Wireless Communication above 200 GHz., , и . ISWCS, стр. 335-339. IEEE, (2019)A 128-Pixel System-on-a-Chip for Real-Time Super-Resolution Terahertz Near-Field Imaging., , , , , , , , и . IEEE J. Solid State Circuits, 53 (12): 3599-3612 (2018)Towards THz high data-rate communication: a 50 Gbps all-electronic wireless link at 240 GHz., , , , и . NANOCOM, стр. 25:1-25:2. ACM, (2017)A 64-Pixel 0.42-THz Source SoC With Spatial Modulation Diversity for Computational Imaging., , , , и . IEEE J. Solid State Circuits, 55 (12): 3281-3293 (2020)Signal-processing Challenges in Leveraging 100 Gb/s Wireless THz., , , , , и . 6G SUMMIT, стр. 1-5. IEEE, (2020)Electronic textiles: A platform for pervasive computing., , , , , , , , , и 7 other автор(ы). Proc. IEEE, 91 (12): 1995-2018 (2003)100 Gbps and beyond: Hardware in the Loop experiments with PSSS modulation using 230 GHz RF frontend., , , , , и . WPNC, стр. 1-5. IEEE, (2018)