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Deep Learning-Based Subsurface Damage Localization Using Full-Field Surface Strains., , и . Sensors, 23 (17): 7445 (сентября 2023)Integration scheme for 3D NAND with nonreplacement word line and its cell characteristics investigation., , , , , , , , , и 5 other автор(ы). IMW, стр. 1-4. IEEE, (2021)Modeling and Optimization of Advanced 3D NAND Memory., , , , , , , и . DRC, стр. 1-2. IEEE, (2020)An Integrated Job Monitor, Analyzer and Predictor., и . CLUSTER, стр. 609-617. IEEE, (2021)BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond., , , , , , , , , и 23 other автор(ы). VLSI Technology and Circuits, стр. 1-2. IEEE, (2023)MAP: A Visual Analytics System for Job Monitoring and Analysis., и . CLUSTER, стр. 442-448. IEEE, (2020)Highly-Doped Through-Contact Silicon Epi Design at 3 nm node., , , , , , , , , и 1 other автор(ы). DRC, стр. 55-56. IEEE, (2019)An improved content based collaborative filtering algorithm for movie recommendations., , и . IC3, стр. 1-3. IEEE Computer Society, (2017)