Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Design and Implementation a Self-starting Thermal Energy Harvester with Resonant Startup and Maximum Power Point Tracking Capabilities/or Wireless Sensor Nodes., , , , , , , and . ISOCC, page 95-96. IEEE, (2019)A Study on Coarse Stage Bit Allocation to Improve Power Efficiency of a 10-bit Coarse-Fine SAR ADC Implemented in 65nm CMOS Process for Environmental Sensing Applications., , , , , , , , , and . TENCON, page 1352-1356. IEEE, (2018)Low Power Converter for Capacitive Sensors Using Capacitance-to-Pulse Width Modulation., , , , , , and . TENCON, page 570-573. IEEE, (2018)FPGA-based Features Extraction Sensor for Lettuce Crop., , , , , , , , and . TENCON, page 269-273. IEEE, (2020)A 288nV/√Hz low-noise capacitively-coupled instrumentation amplifier (CCIA) in 22-nm UTBB FD-SOI for signal conditioning of MEMS piezoresistive pressure sensors., , , , , , , , , and 2 other author(s). ISOCC, page 267-268. IEEE, (2023)Comparison of hardware-optimized CNN and SVM models for human activity recognition using the HARTH and HAR 70 + datasets., , , , , and . ISOCC, page 107-108. IEEE, (2023)An Ultra-Low Power Direct Active-RF Detection Wake-Up Receiver with Noise-Cancelling Envelope Detector in 65 nm CMOS Process., , , , , , and . TENCON, page 12-15. IEEE, (2018)Design and Implementation of a Pipelined RV32IMC Processor with Interrupt Support for Large-Scale Wireless Sensor Networks., , , , , , , , , and 1 other author(s). TENCON, page 806-811. IEEE, (2020)A gm/ID Based Algorithm for the Design of CMOS Miller Operational Amplifiers in 65 nm Technology., , , , , , , and . TENCON, page 1870-1875. IEEE, (2018)An Energy-Efficient Temperature Sensor Using CMOS Thyristor Delay Elements., , , and . ICM, page 1-4. IEEE, (2020)