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Evaluation of SiC Schottky Diodes Using Pressure Contacts., , , , , , , and . IEEE Trans. Ind. Electron., 64 (10): 8213-8223 (2017)Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective., , , , and . Microelectron. Reliab., (2017)Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables., , , , , , and . Microelectron. Reliab., (2018)Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications., , , , , , and . IEEE Access, (2019)Sintered silver finite element modelling and reliability based design optimisation in power electronic module., , and . Microelectron. Reliab., 55 (6): 919-930 (2015)A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module., , and . Microelectron. Reliab., 55 (11): 2371-2381 (2015)Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module., , , and . IEEE Access, (2024)