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3D integration demonstration of a wireless product with design partitioning.

G. Druais, P. Ancey, C. Aumont, V. Caubet, L. Chapelon, C. Chaton, S. Cheramy, S. Cordova, E. Cirot, J. Colonna, P. Coudrain, T. Divel, Y. Dodo, A. Farcy, N. Guitard, K. Haxaire, N. Hotellier, F. Leverd, R. Liou, J. Michailos, A. Ostrovsky, S. Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, and N. Sillon. 3DIC, page 1-5. IEEE, (2011)

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Pascal Vogel

Pascal Siegers

Pascal Schneider

Pascal Häller

Pascal Bastian

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Silicon on Nothing Mems Electromechanical ResonatorC. Durand, F. Casset, P. Ancey, F. Judong, A. Talbot, R. Quenouillere, D. Renaud, S. Borel, B. Florin, and L. Buchaillot. CoRR, (2008)Ambient functionality in MIMOSA from technology to services.P. Ancey. sOc-EUSAI, page 35-38. ACM, (2005)A method reducing the time of RF test for Coupled Resonator Filters.W. Sahyoun, P. Benech, J. Duchamp, G. Parat, and P. Ancey. ICECS, page 731-734. IEEE, (2009)3D integration demonstration of a wireless product with design partitioning.G. Druais, P. Ancey, C. Aumont, V. Caubet, L. Chapelon, C. Chaton, S. Cheramy, S. Cordova, E. Cirot, J. Colonna and 17 other author(s). 3DIC, page 1-5. IEEE, (2011)Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.L. Cadix, A. Farcy, C. Bermond, C. Fuchs, P. Leduc, M. Rousseau, M. Assous, A. Valentian, J. Roullard, E. Eid and 3 other author(s). 3DIC, page 1-7. IEEE, (2009)Monolithic above-IC resonator technology for integrated architectures in mobile and wireless communication.M. Dubois, J. Carpentier, P. Vincent, C. Billard, G. Parat, C. Müller, P. Ancey, and P. Conti. IEEE J. Solid State Circuits, 41 (1): 7-16 (2006)Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.E. Eid, T. Lacrevaz, S. de Rivaz, C. Bermond, B. Fléchet, F. Calmon, C. Gontrand, A. Farcy, L. Cadix, and P. Ancey. 3DIC, page 1-6. IEEE, (2009)60µW SMR BAW oscillator designed in 65nm CMOS technology.S. Dossou, N. Abelé, E. César, P. Ancey, J. Carpentier, P. Vincent, and J. Fournier. ISCAS, page 1456-1459. IEEE, (2008)Design of a fully-integrated BiCMOS/FBAR reconfigurable RF receiver front-end.C. Moreira, A. Shirakawa, E. Kerherve, J. Pham, P. Jarry, D. Belot, and P. Ancey. SBCCI, page 138-143. ACM, (2005)Measurement of Nano-Displacement Based on In-Plane Suspended-Gate MOSFET Detection Compatible with a Front-End CMOS Process.É. Colinet, C. Durand, P. Audebert, P. Renaux, D. Mercier, L. Duraffourg, E. Ollier, F. Casset, P. Ancey, L. Buchaillot and 1 other author(s). ISSCC, page 332-333. IEEE, (2008)

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Disambiguation of "Ancey, Pascal"

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3D integration demonstration of a wireless product with design partitioning.

Please choose a person to relate this publication to

Pascal Vogel

Pascal Siegers

Pascal Schneider

Pascal Häller

Pascal Bastian

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Ancey, Pascal"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML 3D integration demonstration of a wireless product with design partitioning.

Please choose a person to relate this publication to

Pascal Vogel

Pascal Siegers

Pascal Schneider

Pascal Häller

Pascal Bastian

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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MSOffice XML

3D integration demonstration of a wireless product with design partitioning.