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Constructive solid analysis: a hierarchical, geometry-based meshless analysis procedure for integrated design and analysis., , and . Comput. Aided Des., 36 (5): 473-486 (2004)A TSV-cross-link-based approach to 3D-clock network synthesis for improved robustness., , , and . ACM Great Lakes Symposium on VLSI, page 15-20. ACM, (2014)Thermally induced wrinkling in thin-film stacks on patterned substrates., , , , and . IBM J. Res. Dev., 53 (3): 12 (2009)Improved Dixon Resultant for Generating Signed Algebraic Level Sets and Algebraic Boolean Operations on Closed Parametric Surfaces., and . Comput. Aided Des., (2021)Maximum Entropy Models for Fatigue Damage in Metals with Application to Low-Cycle Fatigue of Aluminum 2024-T351., and . Entropy, 21 (10): 967 (2019)Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias., , and . Microelectron. Reliab., 53 (1): 63-69 (2013)Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys., , , , and . Microelectron. Reliab., 53 (6): 892-898 (2013)HiGeoM: A symbolic framework for a unified function space representation of trivariate solids for isogeometric analysis., , , and . Comput. Aided Des., (2015)Maintaining an Accurate Printer Characterization., and . CIC, page 203-210. Society for Imaging Science and Technology, (2004)Reliability of Metal-Dielectric Structures Under Intermittent Current Pulsing., , , , , and . IRPS, page 1-6. IEEE, (2020)