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A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os., , , , , and . DATE, page 1-4. European Design and Automation Association, (2014)Silicon microring-based integrated circuit for optical label-free biosensor with direct electrical readout., , , , , , , , , and 2 other author(s). OFC/NFOEC, page 1-3. IEEE, (2013)High efficient suspended coupler based on IME's MPW platform with 193nm lithography., , , , , , , , and . OFC, page 1-3. IEEE, (2017)3D electro-optical integration based on high-performance Si photonics TSV interposer., , , , , , , and . OFC, page 1-3. IEEE, (2016)A 2.5-D Memory-Logic Integration With Data-Pattern-Aware Memory Controller., , , , , and . IEEE Des. Test, 32 (4): 49-58 (2015)RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology., , and . Microelectron. Reliab., 43 (3): 367-370 (2003)2D asymmetric silicon waveguide grating for optical transceiver., , , and . OFC, page 1-3. IEEE, (2014)High-speed and low-power 2.5D I/O circuits for memory-logic-integration by through-silicon interposer., , , , , and . 3DIC, page 1-4. IEEE, (2013)Silicon photonic transceivers in the field of optical communication., , , , , and . Nano Commun. Networks, (2022)Waveguide germanium photodetector with high bandwidth and high L-band responsivity., , , , and . OFC/NFOEC, page 1-3. IEEE, (2013)