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Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers., , , , , , and . OFC, page 1-3. IEEE, (2017)Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays., , , , , and . OFC, page 1-3. IEEE, (2022)2 × 56 GB/s from a double side electroabsorption modulated DFB laser., , , , , , , and . OFC, page 1-3. IEEE, (2016)4 × 56 Gb/s high output power electroabsorption modulated laser array., , , , , , and . OFC, page 1-3. IEEE, (2017)Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips., , , , , , , , , and 5 other author(s). OFC, page 1-3. IEEE, (2016)InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2020)Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser., , , and . Microelectron. Reliab., 46 (2-4): 421-431 (2006)4 x 200 Gb/s EML-Array with a Single MQW Layer Stack., , , , , , , , and . OFC, page 1-4. IEEE, (2023)56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes., , , , , , and . OFC, page 1-3. IEEE, (2023)8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding., , , , , , , , , and 4 other author(s). OFC, page 1-3. IEEE, (2017)