Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

VSP - A gate stack analyzer., , , , , , , , , and . Microelectron. Reliab., 47 (4-5): 704-708 (2007)Stress evolution in the metal layers of TSVs with Bosch scallops., , and . Microelectron. Reliab., 53 (9-11): 1602-1605 (2013)Three-Dimensional MOS Device Simulation on a Connection Machine., , and . PPSC, page 388-393. SIAM, (1991)Shared-memory parallelization of the semi-ordered fast iterative method., , , and . SpringSim (HPS), page 217-224. SCS/ACM, (2015)Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation., , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 18 (12): 1741-1749 (1999)Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors., and . Sensors, 15 (4): 7206-7227 (2015)Subband Structure and Ballistic Conductance of a Molybdenum Disulfide Nanoribbon in Topological 1T' Phase: A k·p Study., , and . MIXDES, page 168-171. IEEE, (2020)On smoothing three-dimensional Monte Carlo ion implantation simulation results., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 22 (7): 879-883 (2003)Calculation of contact currents in device simulation., , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 11 (1): 128-136 (1992)Mixed-element decomposition method for three-dimensional grid adaptation., and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 17 (7): 561-572 (1998)