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A novel mechanical diced trench structure for warpage reduction in wafer level packaging process.

C. Zhu, H. Li, G. Xu, and L. Luo. Microelectron. Reliab., 55 (2): 418-423 (2015)

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Chunsheng Wei

Chunsheng Li

Junjiang Zhu

Zhu Dai

Changbao Zhu

Other publications of authors with the same name

Surfing the Internet-of-Things: Lightweight Access and Control ofWireless Sensor Networks Using Industrial Low Power Protocols.Z. Sheng, C. Zhu, and V. Leung. EAI Endorsed Trans. Ind. Networks Intell. Syst., 1 (1): e2 (2014)RSU-Empowered Resource Pooling for Task Scheduling in Vehicular Fog Computing.C. Tang, C. Zhu, X. Wei, W. Chen, and J. Rodrigues. IWCMC, page 1758-1763. IEEE, (2020)A survey on communication and data management issues in mobile sensor networks.C. Zhu, L. Shu, T. Hara, L. Wang, S. Nishio, and L. Yang. Wirel. Commun. Mob. Comput., 14 (1): 19-36 (2014)Special issue on deep learning for on-chip learning.W. Wei, J. Wu, and C. Zhu. Des. Autom. Embed. Syst., 24 (3): 127-128 (2020)Editorial: Machine Learning and Intelligent Wireless Communications (MLICOM 2017).X. Gu, and C. Zhu. Mob. Networks Appl., 23 (2): 261-262 (2018)Performance Comparison of Cognitive Radio Sensor Networks for Industrial IoT With Different Deployment Patterns.W. Li, C. Zhu, V. Leung, L. Yang, and Y. Ma. IEEE Syst. J., 11 (3): 1456-1466 (2017)A Review on Design and Implementation of Software-Defined WLANs.K. Qureshi, L. Wang, L. Sun, C. Zhu, and L. Shu. IEEE Syst. J., 14 (2): 2601-2614 (2020)Subtask Scheduling for Distributed Robots in Cloud Manufacturing.W. Li, C. Zhu, L. Yang, L. Shu, E. Ngai, and Y. Ma. IEEE Syst. J., 11 (2): 941-950 (2017)An improved parallel block Lanczos algorithm over GF(2) for integer factorization.L. Yang, Y. Huang, J. Feng, Q. Pan, and C. Zhu. Inf. Sci., (2017)HC-TUS: Human Cognition-Based Trust Update Scheme for AI-Enabled VANET.W. Fang, C. Zhu, M. Guizani, J. Rodrigues, and W. Zhang. IEEE Netw., 37 (5): 247-252 (September 2023)

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Disambiguation of "Zhu, Chunsheng"

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A novel mechanical diced trench structure for warpage reduction in wafer level packaging process.

Please choose a person to relate this publication to

Chunsheng Wei

Chunsheng Li

Junjiang Zhu

Zhu Dai

Changbao Zhu

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Zhu, Chunsheng"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML A novel mechanical diced trench structure for warpage reduction in wafer level packaging process.

Please choose a person to relate this publication to

Chunsheng Wei

Chunsheng Li

Junjiang Zhu

Zhu Dai

Changbao Zhu

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
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A novel mechanical diced trench structure for warpage reduction in wafer level packaging process.