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Disambiguation of "Takemura, Koichi"

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3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's.

, , , , and . 3DIC, page 1-4. IEEE, (2010)

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Koichi Matsumoto

Koichi Koshi

Koichi Morikawa

 

Other publications of authors with the same name

SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration., , , , , and . 3DIC, page 1-5. IEEE, (2009)Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers., , , , , , , , and . 3DIC, page 1-6. IEEE, (2019)Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates., , , , , , , , , and 1 other author(s). 3DIC, page 1-4. IEEE, (2009)Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors., , , , , , , , , and . ECOC, page 1-4. IEEE, (2020)Fingertip-Size Optical Module, Öptical I/O Core", and Its Application in FPGA., , , , , , , , , and 11 other author(s). IEICE Trans. Electron., 102-C (4): 333-339 (2019)3D stacked buck converter with 15μm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's., , , , and . 3DIC, page 1-4. IEEE, (2010)Error-Free Operation for Fully Connected Wavelength-Routing Interconnect among 8 FPGAs with 2.8-Tbit/s Total Bandwidth., , , , , , and . ECOC, page 1-4. IEEE, (2021)5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF., , , , , , , , , and 10 other author(s). OFC, page 1-3. IEEE, (2015)Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate., , , , , , , , , and 2 other author(s). OFC, page 1-3. IEEE, (2021)