Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Use of OSWALD for analyzing longitudinal data with informative dropout., , , , , , and . Comput. Methods Programs Biomed., 85 (2): 109-114 (2007)Identifying Principal Stratum Causal Effects Conditional on a Post-treatment Intermediate Response., , , and . CLeaR, volume 177 of Proceedings of Machine Learning Research, page 734-753. PMLR, (2022)Bayesian integrative model for multi-omics data with missingness, , , , , , , , and . Bioinformatics, 34 (22): 3801--3808 (2018)Classification Models for Predicting Inflammatory Bowel Disease Healthcare Utilization., , , , , , and . HEALTHINF, page 154-161. SCITEPRESS, (2022)Observer-based approximate optimal tracking control for time-delay systems with external disturbances., and . Int. J. Syst. Sci., 47 (12): 2837-2846 (2016)Fuzzy Guaranteed Cost \(Hınfty\) Control of Uncertain Nonlinear Fuzzy Vehicle Active Suspension with Random Actuator Delay., , , and . Int. J. Fuzzy Syst., 21 (7): 2021-2031 (2019)Optimal Tracking Control of Flight Trajectory for Unmanned Aerial Vehicles., , and . ISIE, page 264-269. IEEE, (2018)TPPMA: New Adaptive BP Neural Network Based on PSO and PCA Algorithms., , , and . ISIE, page 637-642. IEEE, (2018)Efficient medical image enhancement based on CNN-FBB model., , , , , and . IET Image Processing, 13 (10): 1736-1744 (2019)Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)., and . Microelectron. Reliab., 52 (11): 2660-2669 (2012)