( en | de | ru )

 

Disambiguation of "Haroun, Baher"

Author of the publication

copydeleteadd this publication to your clipboard
3.1 An Integrated BAW Oscillator with <±30ppm Frequency Stability Over Temperature, Package Stress, and Aging Suitable for High-Volume Production.

, , , , , , and . ISSCC, page 58-60. IEEE, (2020)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Baher Husain

Wassem Baherli

Baher Mawlawi

Baher Molaoui

Najah Haroun

 

Other publications of authors with the same name

A 20mW 61dB SNDR (60MHz BW) 1b 3rd-order continuous-time delta-sigma modulator clocked at 6GHz in 45nm CMOS., , , , and . ISSCC, page 158-160. IEEE, (2012)A PWM Based Fully Integrated Digital Transmitter/PA for WLAN and LTE Applications., , , , and . IEEE J. Solid State Circuits, 50 (5): 1117-1125 (2015)A 29.5 dBm Class-E Outphasing RF Power Amplifier With Efficiency and Output Power Enhancement Circuits in 45nm CMOS., , , and . IEEE Trans. Circuits Syst. I Regul. Pap., 64-I (8): 1977-1988 (2017)3.1 An Integrated BAW Oscillator with <±30ppm Frequency Stability Over Temperature, Package Stress, and Aging Suitable for High-Volume Production., , , , , , and . ISSCC, page 58-60. IEEE, (2020)Power estimation tool for sub-micron CMOS VLSI circuits., , and . ICCAD, page 204-209. IEEE Computer Society / ACM, (1992)A 110dB SNR and 0.5mW current-steering audio DAC implemented in 45nm CMOS., , , , , , and . ISSCC, page 304-305. IEEE, (2010)High-Efficiency Class-E Power Amplifiers for mmWave Radar Sensors: Design and Implementation., , , , , and . IEEE J. Solid State Circuits, 57 (5): 1291-1299 (2022)Autonomous Vehicles Sensor Needs.. ESSCIRC, page 3. IEEE, (2018)Low power ADC's for wireless communications., , , , , and . MWSCAS, page 694-697. IEEE, (2012)High-Linearity High-Bandwidth (>20GHz) T&H Front Ends Using Active Bootstrapping and Heterogeneous SiGe/CMOS Circuit Co-Design., , , and . ISCAS, page 1-5. IEEE, (2023)