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Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.

J. Li, Q. Tian, H. Zhang, X. Chen, X. Liu, and W. Zhu. IEEE Trans. Ind. Informatics, 14 (11): 4746-4754 (2018)

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Wenhui Zhang

Wenhui Huang

Wenhui Sun

Wenhui Li

Wenhui Guo

Other publications of authors with the same name

A documentation approach for the self-adaptive system design.W. Zhu, and D. Parnas. SEKE, page 791-796. Knowledge Systems Institute Graduate School, (2010)The Mathematical Model and Novel Final Test System for Wafer-Level Packaging.J. Li, W. Tian, H. Liao, C. Zhou, X. Liu, and W. Zhu. IEEE Trans. Ind. Informatics, 13 (4): 1817-1824 (2017)A Surface-Based Federated Chow Test Model for Integrating APOE Status, Tau Deposition Measure, and Hippocampal Surface Morphometry.J. Wu, Y. Su, Y. Chen, W. Zhu, E. Reiman, R. Caselli, K. Chen, P. Thompson, J. Wang, and Y. Wang. CoRR, (2023)An Expert Data Generation Method for Multi-Agent Cooperative Planning Method.W. Zhu, Q. Lin, X. Fu, Q. Wu, K. Tang, and W. Lu. ICAC, page 1-6. IEEE, (2023)Automatic Commit Message Generation: A Critical Review and Directions for Future Work.Y. Zhang, Z. Qiu, K. Stol, W. Zhu, J. Zhu, Y. Tian, and H. Liu. IEEE Trans. Software Eng., 50 (4): 816-835 (April 2024)PDL: Regularizing Multiple Instance Learning with Progressive Dropout Layers.W. Zhu, P. Qiu, O. Dumitrascu, and Y. Wang. CoRR, (2023)TetCNN: Convolutional Neural Networks on Tetrahedral Meshes.M. Farazi, Z. Yang, W. Zhu, P. Qiu, and Y. Wang. IPMI, volume 13939 of Lecture Notes in Computer Science, page 303-315. Springer, (2023)OTRE: Where Optimal Transport Guided Unpaired Image-to-Image Translation Meets Regularization by Enhancing.W. Zhu, P. Qiu, O. Dumitrascu, J. Sobczak, M. Farazi, Z. Yang, K. Nandakumar, and Y. Wang. IPMI, volume 13939 of Lecture Notes in Computer Science, page 415-427. Springer, (2023)Prediction of Spherical Equivalent with Vanilla ResNet.H. Li, W. Zhu, X. Chen, and Y. Wang. MMAC@MICCAI, volume 14563 of Lecture Notes in Computer Science, page 66-74. Springer, (2023)Anisotropic Multi-Scale Graph Convolutional Network for Dense Shape Correspondence.M. Farazi, W. Zhu, Z. Yang, and Y. Wang. WACV, page 3145-3154. IEEE, (2023)

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Disambiguation of "Zhu, Wenhui"

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Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.

Please choose a person to relate this publication to

Wenhui Zhang

Wenhui Huang

Wenhui Sun

Wenhui Li

Wenhui Guo

Other publications of authors with the same name

Disambiguation

BibSonomy

Disambiguation of "Zhu, Wenhui"

copydeleteadd this publication to your clipboardcommunity posthistory of this postURLDOIBibTeXEndNoteAPAChicagoDIN 1505HarvardMSOffice XML Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.

Please choose a person to relate this publication to

Wenhui Zhang

Wenhui Huang

Wenhui Sun

Wenhui Li

Wenhui Guo

Other publications of authors with the same name

Disambiguation

copy delete add this publication to your clipboard
community post
history of this post
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
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Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.