( en | de | ru )

 

Disambiguation

From post

копироватьудалитьдобавить публикацию в буфер
Architectural evaluations on TSV redundancy for reliability enhancement.

, , , и . DATE, стр. 566-571. IEEE, (2017)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed.

Hao Chen

Hao Chen

Hao Chen

Hao Chen

Yen-Chih Chen

 

Другие публикации лиц с тем же именем

Evidence for featural units in the acquisition of speech production skills: Linguistic structure in foreign accent., , и . J. Phonetics, 37 (4): 357-373 (2009)Again-VC: A One-Shot Voice Conversion Using Activation Guidance and Adaptive Instance Normalization., , , и . ICASSP, стр. 5954-5958. IEEE, (2021)Comparing L1's effects on English coda obstruent perception: Mandarin and Korean identification performance., и . ICPhS, University of Glasgow, (2015)Timing Aware Wrapper Cells Reduction for Pre-bond Testing in 3D-ICs., , , и . SoCC, стр. 236-241. IEEE, (2019)A novel cache-utilization based dynamic voltage frequency scaling (DVFS) mechanism for reliability enhancements., , , , и . DATE, стр. 79-84. IEEE, (2016)Attitudes towards Knowledge Transfer in the Context of Web Problem-Based Learning Integrated Circuits Course From the Perspective of High School Students., , , , и . ICALT, стр. 709-710. IEEE Computer Society, (2009)VQVC+: One-Shot Voice Conversion by Vector Quantization and U-Net Architecture., , и . INTERSPEECH, стр. 4691-4695. ISCA, (2020)Architectural evaluations on TSV redundancy for reliability enhancement., , , и . DATE, стр. 566-571. IEEE, (2017)Crosstalk-aware TSV-buffer Insertion in 3D IC., , , , и . SoCC, стр. 400-405. IEEE, (2019)AGAIN-VC: A One-shot Voice Conversion using Activation Guidance and Adaptive Instance Normalization., , , и . CoRR, (2020)