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3D resistive RAM cell design for high-density storage class memory - a review.

B. Hudec, C. Hsu, I. Wang, W. Lai, C. Chang, T. Wang, K. Fröhlich, C. Ho, C. Lin, и T. Hou. Sci. China Inf. Sci., 59 (6): 061403:1-061403:21 (2016)

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Tuo Li

Biguang Tuo

Rudolf Tuor

Xihe Tuo

Tuo Liu

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