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Disambiguation of "Vanfleteren, Jan"

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Feasibility Study and Performance Analysis of a Gyroless Orientation Tracker.

, , , and . IEEE Trans. Instrumentation and Measurement, 61 (8): 2274-2282 (2012)

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To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Tsai-Yu Jansen

Einfluss der Konversion laparoskopischer Operationen auf Tumorwachstum, hepatische Metastasierung und Tumorangiogenese. Uni Heidelberg, (2010)

Dirk Jansen

Temperaturkorrektur von mit dem Falling-Weight-Deflectometer gemessenen Deflexionen auf Asphaltbefestigungen. Uni Duisburg-Essen, (2009)

Matthäus Janczyk

Synthese funktionalisierter Trinukleotide und ihre Anwendung bei der Randomisierung. Uni Greifswald, (2009)

Christoph Janello

Wertschöpfung im digitalisierten Buchmarkt. Uni München, (2010)

Richard Janissen

Biomolecular based nano-manipulation with a combined atomic force microscope and single molecule fluorescence setup. Uni Düsseldorf, (2009)
 

Other publications of authors with the same name

Stretchable biocompatible electronics by embedding electrical circuitry in biocompatible elastomers., , and . EMBC, page 6007-6010. IEEE, (2012)Design and implementation of flexible and stretchable systems., , , , , , , , and . Microelectron. Reliab., 51 (6): 1069-1076 (2011)Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability., , , , , , , and . Microelectron. Reliab., 55 (1): 143-154 (2015)A Novel Method for Component Positioning in Thermoformed Electronics., , and . SYSINT, volume 546 of Lecture Notes in Networks and Systems, page 607-615. Springer, (2022)Feasibility Study and Performance Analysis of a Gyroless Orientation Tracker., , , and . IEEE Trans. Instrumentation and Measurement, 61 (8): 2274-2282 (2012)Design Automation of Meandered Interconnects for Stretchable Circuits., , , , and . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 38 (9): 1648-1660 (2019)Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor., , , , and . Microelectron. Reliab., 53 (7): 956-963 (2013)Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles., , and . Sensors, 22 (1): 156 (2022)Capacitive sensor network for composites production monitoring., , , and . IEEE SENSORS, page 1-3. IEEE, (2016)Comparison of different flex materials in high density flip chip on flex applications., , , , , and . Microelectron. Reliab., 43 (3): 445-451 (2003)