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Disambiguation of "Mak, Pui-In"

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A 0.05-mm2 2.91-nJ/Decision Keyword-Spotting (KWS) Chip Featuring an Always-Retention 5T-SRAM in 28-nm CMOS.

, , , , and . IEEE J. Solid State Circuits, 59 (2): 626-635 (February 2024)

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Ellen Mak

Beatrice Puiu

Rebecca Mak

Kwok Mak

Ale PuÌ

 

Other publications of authors with the same name

26.9 A 0.038mm2 SAW-less multiband transceiver using an N-Path SC gain loop., , and . ISSCC, page 452-454. IEEE, (2016)An open-source-input, ultra-wideband LNA with mixed-voltage ESD protection for full-band (170-to-1700 MHz) mobile TV tuners., , and . ISCAS, page 668-671. IEEE, (2008)A single-to-differential LNA topology with robust output gain-phase balancing against balun imbalance., , and . ISCAS, page 289-292. IEEE, (2011)Low-Phase-Noise Wideband Mode-Switching Quad-Core-Coupled mm-wave VCO Using a Single-Center-Tapped Switched Inductor., , , and . IEEE J. Solid State Circuits, 53 (11): 3232-3242 (2018)A 0.18-V 382-µW Bluetooth Low-Energy Receiver Front-End With 1.33-nW Sleep Power for Energy-Harvesting Applications in 28-nm CMOS., , , , and . IEEE J. Solid State Circuits, 53 (6): 1618-1627 (2018)A 53-to-75-mW, 59.3-dB HRR, TV-Band White-Space Transmitter Using a Low-Frequency Reference LO in 65-nm CMOS., , and . IEEE J. Solid State Circuits, 48 (9): 2078-2089 (2013)A Multiband FDD SAW-Less Transmitter for 5G-NR Featuring a BW-Extended N-Path Filter-Modulator, a Switched-BB Input, and a Wideband TIA-Based PA Driver., , , , and . IEEE J. Solid State Circuits, 55 (12): 3387-3399 (2020)A 47-nW Voice Activity Detector (VAD) Featuring a Short-Time CNN Feature Extractor and an RNN-Based Classifier With a Non-Volatile CAP-ROM., , , , and . IEEE J. Solid State Circuits, 58 (11): 3020-3029 (November 2023)A Miniaturized 3-D-MRI Scanner Featuring an HV-SOI ASIC and Achieving a 10 × 8 × 8 mm3 Field of View., , , , and . IEEE J. Solid State Circuits, 58 (7): 2028-2039 (2023)A Constant-Power and Optimal-Transfer-Efficiency Wireless Inductive Power Transfer Converter for Battery Charger., , , , and . IEEE Trans. Ind. Electron., 71 (1): 450-461 (2024)