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Disambiguation of "yao Chang, Zu"

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A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound.

, , , , , , , , , , and . CICC, page 1-4. IEEE, (2017)

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Chang Yao

Hyi-yao Chang

Tsen-Yao Chang

Chi-Yao Chang

Yao Yao

 

Other publications of authors with the same name

A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes., , , , , , , , , and 1 other author(s). IEEE J. Solid State Circuits, 53 (11): 3050-3064 (2018)A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging., , , , , , , , , and 1 other author(s). IEEE J. Solid State Circuits, 53 (8): 2284-2297 (2018)A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging., , , , , , , , , and 1 other author(s). IEEE J. Solid State Circuits, 53 (7): 2065-2075 (2018)A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays., , , , , , , and . IEEE J. Solid State Circuits, 58 (6): 1693-1705 (2023)An eddy-current displacement-to-digital converter based on a ratio-metric delta-sigma ADC., , , , , and . ESSCIRC, page 403-406. IEEE, (2014)A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink., , , , , , , and . VLSI Technology and Circuits, page 1-2. IEEE, (2023)A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes., , , , , , , , , and 1 other author(s). ESSCIRC, page 211-214. IEEE, (2017)A 7 μW Offset- and Temperature-Compensated pH-to-Digital Converter., , , , , and . J. Sensors, (2017)An Element-Matched Electromechanical ΔΣ ADC for Ultrasound Imaging., , , , , , and . IEEE J. Solid State Circuits, 53 (10): 2795-2805 (2018)A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes., , , , , , , , , and 2 other author(s). IEEE J. Solid State Circuits, 59 (2): 476-491 (February 2024)