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Shared-memory parallelization of the semi-ordered fast iterative method., , , и . SpringSim (HPS), стр. 217-224. SCS/ACM, (2015)Three-Dimensional MOS Device Simulation on a Connection Machine., , и . PPSC, стр. 388-393. SIAM, (1991)Three-dimensional simulation of HPCVD-linking continuum transport and reaction kinetics with topography simulation., , , и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 18 (12): 1741-1749 (1999)VSP - A gate stack analyzer., , , , , , , , , и . Microelectron. Reliab., 47 (4-5): 704-708 (2007)Stress evolution in the metal layers of TSVs with Bosch scallops., , и . Microelectron. Reliab., 53 (9-11): 1602-1605 (2013)The meshing framework ViennaMesh for finite element applications., , , и . J. Comput. Appl. Math., (2014)A shared memory parallel multi-mesh fast marching method for re-distancing., , , и . Adv. Comput. Math., 45 (4): 2029-2045 (2019)Subband Structure and Ballistic Conductance of a Molybdenum Disulfide Nanoribbon in Topological 1T' Phase: A k·p Study., , и . MIXDES, стр. 168-171. IEEE, (2020)Mixed-element decomposition method for three-dimensional grid adaptation., и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 17 (7): 561-572 (1998)Implications of Analytical Investigations About the Semiconductor Equations on Device Modeling Programs., и . IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 3 (1): 52-64 (1984)