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A methodological approach for predictive reliability: Practical case studies., , , and . Microelectron. Reliab., 52 (12): 3035-3042 (2012)Electro- and thermo-migration induced failure mechanisms in Package on Package., , and . Microelectron. Reliab., 52 (12): 2889-2906 (2012)Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage., , , , and . Microelectron. Reliab., 49 (9-11): 1267-1272 (2009)Sequential combined thermal cycling and vibration test and simulation of printed circuit board., , , and . Microelectron. Reliab., (2018)Editorial., , , , and . Microelectron. Reliab., 55 (9-10): 1269-1270 (2015)How to study delamination in plastic encapsulated devices., , , and . Microelectron. Reliab., 44 (9-11): 1311-1316 (2004)Effects of salt spray test on lead-free solder alloy., , , , and . Microelectron. Reliab., (2016)Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers., , and . Microelectron. Reliab., 52 (9-10): 1827-1832 (2012)A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages., , , , and . Microelectron. Reliab., 49 (9-11): 1273-1277 (2009)Improved physical understanding of intermittent failure in continuous monitoring method., , , and . Microelectron. Reliab., 46 (9-11): 1886-1891 (2006)