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Disambiguation of "Yeh, Wen-Kuan"

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Relationship of Channel and Surface Orientation to Mechanical and Electrical Stresses on N-Type FinFETs.

, , , and . IEICE Trans. Electron., 102-C (6): 429-434 (2019)

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Pei Kuang

Kuan Tong

Kuan Yang

Peng Kuang

Xutao Kuang

 

Other publications of authors with the same name

Significantly improving sub-90 nm CMOSFET performances with notch-gate enhanced high tensile-stress contact etch stop layer., , , and . Microelectron. Reliab., 48 (11-12): 1791-1794 (2008)The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs., , , , and . Microelectron. Reliab., 47 (6): 944-952 (2007)Reliability of the doping concentration in an ultra-thin body and buried oxide silicon on insulator (SOI) and comparison with a partially depleted SOI., , and . Microelectron. Reliab., 54 (2): 485-489 (2014)Relationship of Channel and Surface Orientation to Mechanical and Electrical Stresses on N-Type FinFETs., , , and . IEICE Trans. Electron., 102-C (6): 429-434 (2019)The impact of interface/border defect on performance and reliability of high-k/metal-gate CMOSFET., , , , and . Microelectron. Reliab., 53 (2): 265-269 (2013)NBTI reliability on high-k metal-gate SiGe transistor and circuit performances., , , and . Microelectron. Reliab., 51 (5): 914-918 (2011)Using Capacitance Sensor to Extract Characteristic Signals of Dozing from Skin Surface., , , , , , , , , and 3 other author(s). J. Sensors, (2014)Impact of strain on hot electron reliability of dual-band power amplifier and integrated LNA-mixer RF performances., , , and . Microelectron. Reliab., 50 (6): 807-812 (2010)Substrate Bias Effect on Dynamic Characteristics of a Monolithically Integrated GaN Half-Bridge., , , , and . IRPS, page 1-5. IEEE, (2020)Influence of fin number on hot-carrier injection stress induced degradation in bulk FinFETs., , , , , , , , , and . Microelectron. Reliab., (2016)