Author of the publication

A design of detection algorithm based on thermal regions separation for pressure vessels.

, , , , , , , and . I2MTC, page 1-6. IEEE, (2018)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Snapshot density queries on location sensors., and . MobiDE, page 75-78. ACM, (2007)Multidimensional Fractional-Order Newton-Based Extremum Seeking for Online Light-Energy Saving Technique of Lighting System., , , , , and . IEEE Trans. Ind. Electron., 67 (10): 8576-8586 (2020)Design of multi-objective guided filter infrared thermal image fusion for hypervelocity impact damages detection., , , , and . J. Frankl. Inst., 361 (2): 712-731 (2024)Design of adaptive backstepping dynamic surface control method with RBF neural network for uncertain nonlinear system., , , , and . Neurocomputing, (2019)Research on Damages Evaluation Method With Multi-Objective Feature Extraction Optimization Scheme for M/OD Impact Risk Assessment., , , , , and . IEEE Access, (2019)S-GRID: A Versatile Approach to Efficient Query Processing in Spatial Networks., , , and . SSTD, volume 4605 of Lecture Notes in Computer Science, page 93-111. Springer, (2007)An enhance feature algorithm for defect detection of pneumatic pressure equipment using eddy current pulsed thermography., , , , , , , and . I2MTC, page 1-6. IEEE, (2018)Multiple k Nearest Neighbor Query Processing in Spatial Network Databases., , and . ADBIS, volume 4152 of Lecture Notes in Computer Science, page 266-281. Springer, (2006)Radar emitter identification with bispectrum and hierarchical extreme learning machine., , , , and . Multimedia Tools Appl., 78 (20): 28953-28970 (2019)Artificial intelligence in impact damage evaluation of space debris for spacecraft., , , , and . Frontiers Inf. Technol. Electron. Eng., 23 (4): 511-514 (2022)