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Progress in the methodologies for the electrical modeling of interconnects and electronic packages.

, and . Proc. IEEE, 89 (5): 740-771 (2001)

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Progress in the methodologies for the electrical modeling of interconnects and electronic packages., and . Proc. IEEE, 89 (5): 740-771 (2001)Multi-GHz interconnect effects in microprocessors., , and . ISPD, page 93-97. ACM, (2001)Measuring Error Propagation in Waveform Relaxation Algorithms., , and . ICCAD, page 170-173. IEEE Computer Society, (1990)Corrections to Optimized Waveform Relaxation Methods for Longitudinal Partitioning of Transmission Lines Aug 09 1732-1743., , and . IEEE Trans. Circuits Syst. I Regul. Pap., 57-I (1): 312 (2010)Skin-Effect Loss Models for Time- and Frequency-Domain PEEC Solver., , and . Proc. IEEE, 101 (2): 451-472 (2013)A Low-Frequency-Stable Higher-Order Spline-Based Integral Equation Method., , , , , and . CoRR, (2024)A Spline-based Partial Element Equivalent Circuit Method for Electrostatics., , , and . CoRR, (2022)An overview of the BlueGene/L Supercomputer., , , , , , , , , and 105 other author(s). SC, page 7:1-7:22. IEEE Computer Society, (2002)Dealing with Inductance in High-Speed Chip Design., , and . DAC, page 904-909. ACM Press, (1999)Three Dimensional Circuit Oriented Electromagnetic Modeling for VLSI Interconnects., , , and . ICCD, page 218-221. IEEE Computer Society, (1992)